In-Depth AI Integration: In the future, AI-based automatic defect detection, automatic measurement path planning, and intelligent diagnosis of measurement results will be realized, further reducing human intervention.

Multi-Sensor Fusion: Integrates multiple sensors such as laser, white light, and contact probes to achieve full-dimensional measurement of complex parts.

Industrial Internet Integration: Deeply connects with systems such as MES and ERP to realize real-time upload and analysis of measurement data, and build a closed-loop quality management system.

Breakthrough in Micro-Nano Measurement: Develops image measurement technology with sub-nanometer precision for micro-nano level parts (such as chips and MEMS devices), combining the advantages of AFM (Atomic Force Microscope) and optical measurement.