The inspection of Multi-Chip Modules (MCM) poses more challenging requirements for image measuring systems due to the unique demand for non-contact and rapid inspection. This is because it necessitates accurate control over various feature elements of multiple module units on a common substrate, such as module positioning, edge location, height measurement, verification of the wire count for each module, and axis alignment characteristics of the substrate.

The wide range of module types, dimensions, and placements, as well as differences in reflectivity and texture between the module and substrate surfaces, require precise resolution and measurement. Critical measurement capabilities needed for image measuring systems include a powerful optical system, multi-angle programmable lighting, and advanced edge detection and image processing capabilities. Additionally, for OGP image measuring systems, the availability of different platform sizes and high-precision motion performance is crucial to achieving the necessary balance between required accuracy and high measurement efficiency.